IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates support critical functions including circuit support and protection, heat dissipation, and signal and power distribution.
IC substrates represent the highest level of miniaturization in PCB manufacturing and shares many similarities with semiconductor manufacturing.
IC substrate has been developing with the booming of new types of ICs like BGA (ball grid array) and CSP (chip scale package) which call for new carriers of package. As one type of the most advanced PCB (Printed Circuit Board), IC substrate PCB has exploded in both popularity and applications together with any layer HDI PCB and flex-rigid PCB, now widely applied in telecommunications and electronics updates.