OEM/ODM Manufacturer Fr4 Ultra-Thin Pcb - 2layer Cem-3 Stiffener FPC | YMSPCB – Yongmingsheng
OEM/ODM Manufacturer Fr4 Ultra-Thin Pcb - 2layer Cem-3 Stiffener FPC | YMSPCB – Yongmingsheng Detail:
When circuits are too complex for single layer wiring or copper foil is needed for grounding shielding, double-layer or even multilayer boards are needed. The most typical difference between a laminate and a monolayer is the addition of a through-hole structure to connect the layers of copper foil. General substrate + transparent adhesive + copper foil the first processing process is the production of holes. First in the substrate and copper foil drilling, cleaning and plating a certain thickness of copper, and then through the hole is finished. And the next process is almost identical to that of a single board.
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By Eileen from Buenos Aires - 2018.12.11 11:26
After the signing of the contract, we received satisfactory goods in a short term, this is a commendable manufacturer.
By mary rash from Algeria - 2017.06.25 12:48