Bottom price China Green Solder Masker 1.6mm Multilayer PCB

Short Description:

Multilayer pcb with sideplating and half-cut castellated holes, the PCB edge is used for technical features of the later assembly.

Parameters

Layers: 10L multilayer pcb

Board Thinkness:2.0mm

Base Material:S1000-2 High tg

Min Holes:0.2mm

Minimum Line Width/Clearance：0.1mm/0.1mm

Minimum Clearance between Inner Layer PTH to Line： 0.2mm

Size：100mm×100mm

Aspect Ratio：10 : 1

Surface treatment：ENIG

Process characteristics: High tg, The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO)

Applications: Communication

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Product Detail

Product Tags

We have state-of-the-art tools. Our products are exported towards the USA, the UK and so on, enjoying a fantastic reputation amongst customers for Bottom price China Green Solder Masker 1.6mm Multilayer PCB, Our Lab now is “National Lab of diesel engine turbo technology ” , and we own a qualified R&D staff and complete testing facility.
We have state-of-the-art tools. Our products are exported towards the USA, the UK and so on, enjoying a fantastic reputation amongst customers for China PCB Board, Double Side PCB, Our company offers the full range from pre-sales to after-sales service, from product development to audit the use of maintenance, based on strong technical strength, superior product performance, reasonable prices and perfect service, we’ll continue to develop, to supply the high-quality goods and services, and promote lasting cooperation with our customers, common development and create a better future.

What is A Multilayer PCB?

Multilayer PCB boards came into play with the intention of constructing more number of conductive layers on the board than single layer or double layer boards. Multi-layer boards come with a combination of single layer or double layer board and give opportunity to connect more electronic components in less space.

multilayer pcb multilayer pcb design buried and blind via High-TG pcb IST test stackup

YMS Multilayer PCB manufacturing capabilities:

YMS Multilayer PCB manufacturing capabilities overview
Feature	capabilities
Layer Count	3-60L
Available Multilayer PCB Technology	Through hole with Aspect Ratio 16:1
	buried and blind via
	Hybrid	High Frequency Material such as RO4350B and FR4 Mix etc.
		High Speed Material such as M7NE and FR4 Mix etc.
Thickness	0.3mm-8mm
Minimum line Width and Space	0.05mm/0.05mm(2mil/2mil)
BGA PITCH	0.35mm
Min mechanical Drilled Size	0.15mm(6mil)
Aspect Ratio for through hole	16:1
Surface Finish	HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc.
Via Fill Option	The via is plated and filled with either conductive or non-conductive epoxy then capped and plated over(VIPPO)
	Copper filled, silver filled
Registration	±4mil
Solder Mask	Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc.