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Cheap price Multilayer Fr-4 Blind Buried Hole Immersion Gold Hdi Pcb/pcb Board/circuit Board

Short Description:

Parameters

Layers: 10

Thickness:1.78±0.15mm

Min.Hole Size:0.1mm

Minimum Line Width/Space:0.10mm/0.10mm

Size:235mm×118mm

Surface treatment:ENIG

Crafts

2 Step HDI Board

electriplating filling

Resin Plug Hole Technology

Applications:Communication


Product Detail

Product Tags

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HDI Structures:

1+N+1 – PCBs contain 1 “build-up” of high-density interconnection layers.

i+N+i (i≥2) – PCBs contain 2 or more “build-up” of high density interconnection layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in challenging designs.

Any Layer HDI – All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures (“any layer via”). This provides a reliable interconnect solution for highly complex large pin-count device

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