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2017 Latest DesignCob Ceramic Substrate Pcb - 8Layer 2 Step HDI Board | YMSPCB – Yongmingsheng

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The organization upholds the philosophy of "Be No.1 in good quality, be rooted on credit history and trustworthiness for growth", will keep on to provide previous and new customers from home and overseas whole-heatedly for Wool Ceramic Fiber Board, Rigid-Flex Board, Silica Ceramic Fiber Board, Welcome worldwide customers to contact us for business and long-term cooperation. We will be your reliable partner and supplier.
2017 Latest DesignCob Ceramic Substrate Pcb - 8Layer 2 Step HDI Board | YMSPCB – Yongmingsheng Detail:

HDI Board production process:

At present, HDI board interconnection between layer and layer is mainly the following design: Staggered holes interconnection, Cross-layer interconnection, ladder interconnection and superposition holes interconnection. Among them, the superposition holes interconnection occupy the least space. There is a research suggests that reducing the number of through holes and increasing the number of blind holes can effectively improve the wiring density. And in the superposition interconnection, the methods of electroplating and resin plug are mainly used, especially the electroplating hole filling method which has more obvious advantages like high reliability and good conduction performance.

Therefore, superposition interconnection is the most widely used design method for blind holes design. The process of stacking between layers is as follows: first blind hole is made, then second blind hole is made after lamination, then multi-blind hole is made according to this method, and the interconnection between layers is realized by electroplating hole filling method.

On the whole, the production process of HDI plate is complex, which needs to be completed after many times of production for a long time. It’s not only high requirements for the accuracy and shrinkage control of each layer, but also high standards in materials, equipment, environment and technical personnel.

You May Like:

1、HDI PCB market conditions

2、Drill holes for printed circuit boards

3、Multi-layer circuit board composition


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2017 Latest DesignCob Ceramic Substrate Pcb - 8Layer 2 Step HDI Board | YMSPCB – Yongmingsheng detail pictures


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Assume full obligation to meet all demands of our customers; accomplish ongoing advancements by promoting the advancement of our customers; become the final permanent cooperative partner of clientele and maximize the interests of shoppers for 2017 Latest DesignCob Ceramic Substrate Pcb - 8Layer 2 Step HDI Board | YMSPCB – Yongmingsheng , The product will supply to all over the world, such as: UK, India, Amman, Since the establishment of our company, we have realized the importance of providing good quality products and the best before-sales and after-sales services. Most problems between global suppliers and clients are due to poor communication. Culturally, suppliers can be reluctant to question things they do not understand. We break down those barriers to ensure you get what you want to the level you expect, when you want it.
  • This company conforms to the market requirement and joins in the market competition by its high quality product, this is an enterprise that have Chinese spirit.
    5 Stars By Beulah from Italy - 2018.05.15 10:52
    The company has a good reputation in this industry, and finally it tured out that choose them is a good choice.
    5 Stars By Madeline from Surabaya - 2017.12.31 14:53
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