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2layer Cem-3 Stiffener FPC | YMSPCB

Short Description:

Parameters

  • Layers: 2
  • Base Material:Polyimide,1OZ,0.2MM finished
  • Minimum Line Width/Clearance:1.0mm/0.8mm
  • Size:85mm×32mm
  • Surface treatment:Lead Free Hasl

Crafts

  • Special Process:
  • 3M Adhesive Tape on the bottom
  • 0.2mm Cem-3 Stiffener

Applications

  • Visual equipment, Touch panel
  • Urgent model after 24-48 hours / normally after 2-3 days shipping


Product Detail

Product Tags

When circuits are too complex for single layer wiring or copper foil is needed for grounding shielding, double-layer or even multilayer boards are needed. The most typical difference between a laminate and a monolayer is the addition of a through-hole structure to connect the layers of copper foil. General substrate + transparent adhesive + copper foil the first processing process is the production of holes. First in the substrate and copper foil drilling, cleaning and plating a certain thickness of copper, and then through the hole is finished. And the next process is almost identical to that of a single board.


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