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Chinese Professional Customized Double Layer Pcb Boards,Print Circuit Boards,Electronics Parts Oem Odm 2019

Short Description:

Parameters

Layers: 10

Thickness:1.78±0.15mm

Min.Hole Size:0.1mm

Minimum Line Width/Space:0.10mm/0.10mm

Size:235mm×118mm

Surface treatment:ENIG

Crafts

2 Step HDI Board

electriplating filling

Resin Plug Hole Technology

Applications:Communication


Product Detail

Product Tags

We pursue the management tenet of “Quality is remarkable, Company is supreme, Name is first”, and will sincerely create and share success with all clientele for Chinese Professional Customized Double Layer Pcb Boards,Print Circuit Boards,Electronics Parts Oem Odm 2019, Our merchandise are new and previous prospects consistent recognition and trust. We welcome new and outdated shoppers to contact us for long term small business relations, common advancement. Let’s speeding within the dark!
We pursue the management tenet of “Quality is remarkable, Company is supreme, Name is first”, and will sincerely create and share success with all clientele for Electronics Parts, Pcb, Pcb Circuit, Our Company policy is “quality first, to be better and stronger, sustainable development” . Our pursuit goals is “for society, customers, employees, partners and enterprises to seek reasonable benefit”. We aspirate to do cooperate with all different the auto parts manufacturers, repair shop, auto peer , then create a beautiful future! Thank you for taking time to browse our website and we would welcome any suggestions you may have that can help us to improve our site.

HDI Structures:

1+N+1 – PCBs contain 1 “build-up” of high-density interconnection layers.

i+N+i (i≥2) – PCBs contain 2 or more “build-up” of high density interconnection layers. Microvias on different layers can be staggered or stacked. Copper filled stacked microvia structures are commonly seen in challenging designs.

Any Layer HDI – All the layers of a PCB are high density interconnection layers which allows the conductors on any layer of the PCB to be interconnected freely with copper filled stacked microvia structures (“any layer via”). This provides a reliable interconnect solution for highly complex large pin-count device


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