Metal clad pcb 1 Layer Thermoelectric Copper base Board| YMSPCB
Copper base Board production process
- Provide the copper plate have pretreated
- UV ink is printed on the bending part of copper plate
- The surface of copper plate is browned by using browning liquid
- Press and drill copper plate covered with UV ink
- Electroplate the first finished product
- Make outer layer on copper plate
- Solder mask printing on copper substrate
- V – CUT the second finished product
- The bending position of copper plate is surface treated and the finished product is obtained
- Check up case ,packing and shipping
YMS copper based PCB manufacturing capabilities:
| YMS copper based PCB manufacturing capabilities overview | ||
| Feature | capabilities | |
| Layer Count | 1-4L | |
| Thermal Conductivity(w/m.k) | Aluminum PCB:0.8-10 | |
| Copper PCB:2.0-398 | ||
| Board Thickness | 0.4mm-5.0mm | |
| copper Thickness | 0.5-10OZ | |
| Minimum line Width and Space | 0.1mm/0.1mm(4mil/4mil) | |
| Speciality | Countersink,Counterbore drilling.etc. | |
| Types of Aluminum Substrates | 1000 series;5000 series;6000 series,3000 series.etc. | |
| Min mechanical Drilled Size | 0.2mm(8mil) | |
| Surface Finish | HASL, Lead free HASL,ENIG,Immersion Tin, OSP, Immersion Silver, Gold Finger, Electroplating Hard Gold, Selective OSP，ENEPIG.etc. | |
| Solder Mask | Green, Red, Yellow, Blue, White, Black, Purple, Matte Black, Matte green.etc. | |
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