Isiseko sesinyithi esinamacala amabini pcb iSiseko seSiseko saMandla aPhakamileyo seBhodi yeNsimbi | YMS PCB

Inkcazo elifutshane:

Eyahlukileyo kunye Single umaleko MCPCB, kabini icala MCPCB kwakhona kufuna inyathelo ecinezelayo elongezelelweyo ukuba laminate umfanekiso thermal conductive laminate kunye core metal (ekwaziwa ngokuba isiseko metal) kunye. Kodwa ngamanye amaxesha, omnye umthengisi we-Metal Clad ekrwada uya kubonelela ngempahla yebhodi esele ilayitiwe.

iparameters

Iileya: 2L

Ukucinga kwebhodi: 4.5mm

Izinto ezisisiseko: iCopper Clad Laminate

Imingxunya emincinci: 0.5mm

Ubuncinci beLayini Ububanzi / ukuCoca: 0.2mm / 0.2mm

Ukucoca ubuncinci phakathi koLuhlu lwangaphakathi lwe-PTH kunye noMgca: 0.2mm

Ubukhulu: 981mm×85mm

Ubungakanani bobume:9 :1

unyango Surface: ENIG

Ubungcali: i-multilayer metal core

Usetyenziso:Abaguquleli

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Yintoni iMulti Layers MCPCB?

Ibhodi Metal Core Printed Circuit Board (MCPCB) , eyaziwa ngokuba yi-PCB ye-thermal okanye i- PCB exhaswa yintsimbi, luhlobo lwe-PCB olunezinto zetsimbi njengesiseko salo senxalenye yebhodi yokusabalalisa ubushushu. Isinyithi esityebileyo (phantse sihlala si-aluminiyam okanye ubhedu) sigquma icala eli-1 lePCB. I-Metal core inokuthi ibhekiselele kwintsimbi, nokuba iphakathi kwindawo ethile okanye ngasemva kwebhodi. Injongo yondoqo we-MCPCB kukuthumela ubushushu kude kumacandelo ebhodi abalulekileyo kunye neendawo ezingabalulekanga kangako ezifana neheatsink exhasayo okanye undoqo wesinyithi. Iintsimbi ezisisiseko kwi-MCPCB zisetyenziswa njengenye i-FR4 okanye iibhodi ze-CEM3.

Ibhodi yesekethe engundoqo eprintiweyo (MCPCB) ekwabizwa ngokuba yi-thermal PCB, ibandakanya imathiriyeli yentsimbi njengesiseko sayo ngokuchasene ne-FR4 yemveli, yeqhekeza lebhodi esasaza ubushushu. Ubushushu buyanda ngenxa yamacandelo athile e-elektroniki ngexesha lokusebenza kwebhodi. Injongo yentsimbi kukuphambukisa obu bushushu busuke kumacandelo ebhodi abalulekileyo kunye nokuya kwiindawo ezingabalulekanga kangako ezifana ne-heatsink exhasayo okanye i-metallic core. Ke, ezi PCB zifanelekile kulawulo lobushushu.

Kwi-MCPCB ye-multilayer, iileyile ziya kuhanjiswa ngokulinganayo kwicala ngalinye lentsimbi yentsimbi. Ngokomzekelo, kwibhodi ye-12-layer, i-core core iya kuba sembindini kunye nemigangatho emi-6 phezulu kunye ne-6 phantsi.

Ii-MCPCBs zikwabizwa ngokuba yi-insulated metallic substrate (IMS), ii-PCB zetsimbi ezigqunyiweyo (IMPCB), iiPCB ezigqunywe nge-thermal, kunye neePCB ezinentsimbi. Kweli nqaku, siza kusebenzisa i-acronym MCPCB ukunqanda ukungaqondakali.

Ii-MCPCB zenziwa ngezaleko ze-thermal insulating, iipleyiti zetsimbi, kunye ne-metal copper foil. Ezinye izikhokelo/iingcebiso zoyilo lweMetal Core (iAluminiyam neCopper) yeeBhodi zeSekethe eziShicileleyo ziyafumaneka xa ziceliwe; qhagamshelana ne-YMSPCB apha kell@ymspcb.com.okanye uMmeli wakho weNtengiso ukubuza ngakumbi.

I-YMS Multi Layers Isiseko sePCB yentsimbi amandla okwenza:

I-YMS Multi Layers Metal core PCB yokuvelisa amagqabantshintshi
Uphawu	amandla
Uluhlu Lomaleko	1-8L
Izinto eziSisiseko	IAluminiyam/yeCopper/Iron ingxubevange
Ukutyeba	0.8 mm umz
Ingqekembe yemali Ukutyeba	0.8-3.0mm
Ubuncinci bomgca ububanzi kunye nendawo	0.05mm / 0.05mm (2mil / 2mil)
IBGA PITCH	0.35mm
Min Copper imvume	1.0mm umz
Ubuncinci boMatshini ogujiweyo	0.15mm (6mil)
Ukulinganiswa kwembonakalo yomngxuma	16: 1
Umphezulu Gqiba	I-HASL, i-HASL yasimahla, i-ENIG, ukuntywila kwi-Tin, i-OSP, iSilver yokuntywila, iFinger Finger, i-Electroplating Hard Hard, i-OSP ekhethiweyo, ENEPIG.etc.
Ukuhamba ngokugcwalisa ukhetho	Ukugqithiswa kufakwe kwaye kugcwaliswe nge-epoxy eqhubayo okanye engaqhubekiyo emva koko yatywinwa yaza yagqunywa ngaphezulu (i-VIPPO)
	Izaliswe ngobhedu, kuzaliswe isilivere
Ubhaliso	± 4mil
Solder Vuvu	Luhlaza, Bomvu, Mthubi, Luhlaza, Mhlophe, Mnyama, Mfusa, Matte Mnyama, Matte luhlaza njl njl.

Izizathu eziphambili zokusebenzisa iibhodi zesiseko sobhedu

1. Ukukhutshwa kakuhle kobushushu:

Okwangoku, iibhodi ezininzi ze- 2 kunye neebhodi ezininzi zinenzuzo yobuninzi obuphezulu kunye namandla aphezulu, kodwa ukukhutshwa kobushushu kunzima ukuba. Izinto eziqhelekileyo zesiseko se-PCB ezifana ne-FR4, i-CEM3 yi-conductor engafanelekanga yobushushu, ukugquma kuphakathi kweeleya, kunye nokukhutshwa kobushushu akukwazi ukuphuma. Ukufudumeza kwendawo yezixhobo zombane akukwazi ukupheliswa kuya kubangela ukungaphumeleli kobushushu obuphezulu bamacandelo e-elektroniki. Kodwa ukusebenza kakuhle kokutshabalalisa ubushushu bentsimbi engundoqo yePCB kunokusombulula le ngxaki yokulahla ubushushu.

2. Uzinzo lweDimensional:

I-Metal core PCB ngokucacileyo izinzile ngakumbi ngobukhulu kuneebhodi eziprintiweyo zezinto ezigqumayo. Ibhodi yesiseko se-aluminiyam kunye nebhodi ye -aluminiyam isangweji ifudumeza ukusuka kwi-30 ℃ ukuya kwi-140 ~ 150 ℃, ubungakanani bayo butshintsha nge-2.5 ~ 3.0%.

3. Omnye unobangela:

Ibhodi yesiseko sobhedu ineempembelelo zokukhusela kwaye ithatha indawo ye-brittle ceramic substrate, ngoko inokuqinisekiswa ukusebenzisa itekhnoloji yokunyusela umphezulu ukunciphisa indawo yokwenyani yePCB. Ibhodi yesiseko sobhedu ithatha indawo yeradiyetha kunye namanye amacandelo, iphucula ukumelana nobushushu kunye nokusebenza ngokomzimba kweemveliso kwaye inciphisa iindleko zemveliso kunye neendleko zabasebenzi.