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How to make pcb | YMSPCB

The creator of the printed circuit board was the Austrian Paul Eisler. In 1936, he first used a printed circuit board on the radio. In 1943, Americans used the technology for military radio. In 1948, the United States officially recognized the invention for commercial use. Since the mid-1950s, printed circuit boards have been widely used.

Prior to the advent of the PCB, the interconnection between the electronic components was done by direct connection of the wires. Today, wires are used only in laboratory applications; printed circuit boards are definitely in an absolute control position in the electronics industry.

PCB production process:

First, contact the manufacturer and make an inquiry, and then register the customer number, then someone will quote for you, place an order, and follow up the production progress.

Second, the material

Purpose: According to the requirements of engineering data MI, cut into small pieces on the large sheet to improve the utilization and convenience.

Process: large sheet material → cutboard according to MI requirements → grind board → edge grinding→ bake board

Third, drill

Purpose: According to the engineering data, the required aperture is drilled at the corresponding position on the sheet of the required size.

Process: upper plate → drill → lower plate → inspection \ repair

Fourth, PTH

Purpose:  Copper layer formed through self-oxidation reaction is for completing electrical interconnection.

Process:  hangplate → copper sinking automatic line → lower plate

Five, layer

Purpose: Transfer graphics  for meeting customer’s requirements.

Process: (blue oil process): grindboard → print the first side → dry→ print the second side → dry → exposure → shadow → inspection; (dry film process): hemp board → laminate → stand → right Bit → Exposure →  Shadow → Check

Sixth, pattern plating

Purpose: Make the thickness of copper in hole wall meeting the quality requirements and the corrosion resistant layer plated for etching.

Process: upper plate → degreasing → water washing twice → micro-etching → water washing → pickling → copper plating → water washing → pickling → tin plating → water washing → lower plate

Seven, film remove

Purpose: Retreat the anti-plating coating layer with NaOH solution to expose the non-line copper layer.

Process: wet film: inserting → soaking alkali → washing → scrubbing → passing machine; dry film: placing board → passing machine

Eight, etching

Purpose: Etching is the use of chemical reaction method to corrode the copper layer in non-line parts.

Nine, solder mask

Purpose: Green oil transfers the pattern of green oil film to the board to protect the line and prevent tin on the line when soldering parts

Process: grind plate → print photosensitive green oil → printing the first side → baking sheet → printing the second side → baking sheet

Ten, silk screen

Purpose: Silk screen are an easy-to-identify markup

Process: After the end of green oil → cooling→ adjust the network → print characters

Eleven, gold-plated fingers

Purpose: Plating a layer of nickel/gold with a required thickness on the plug finger to make it more wear resistant

Process: upper plate → degreasing → water washing twice → micro-etching → water washing twice → pickling → copper plating → water washing → nickel plating → water washing → gold-plated tin plate (a process of juxtaposition)

Twelve, lead-free HASL

Purpose: Spray tin is sprayed with a layer of lead tin on the bare copper surface not covered with solder resist oil to protect the copper surface from oxidation and oxidation to ensure good soldering performance.

Process: micro-etching → air drying → preheating → rosin coating → solder coating → hot air leveling → air cooling → washing and drying

Thirteen, final shaping

Purpose: Through the die stamping or CNC machine to cut out the shape forming method required by the customer.

Fourteen, electrical test

Objective: Through the electronic 100% test, it can detect the open circuit, short circuit and other defects that are not easily found by visual observation.

Process: upper mold → release board → test → qualified → FQC visual inspection → unqualified → repair → return test → OK → REJ → scrap

Fifteen, FQC

Purpose: Through 100% visual inspection of the appearance defects of the board, and repair of minor defects, to avoid problems and defective board outflow.

Specific work flow: incoming materials → view data → visual inspection → qualified → FQA random inspection → qualified → packaging → unqualified → processing → check OK

YMS is a PCB manufacturer in China, We offer low cost with high quality PCB prototype ;We have our own factory established over 10,000 square meters and we possess the latest professional production equipment to handle the PCB manufacturing process.

Products include:printed circuit board, PCB bare board, Bare Board.

Post time: Aug-07-2019
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